DDR2 is the next-generation evolution of DDR memory technology. DDR2 memory features faster speeds, higher data bandwidths, lower power consumption and enhanced thermal performance. DDR2 memory chips will be available in Fine-pitch BGA (FBGA) chip packages for improved electrical and thermal characteristics. In addition, DDR2 memory chips will incorporate On-Die Termination (ODT) to minimize memory signal reflections at high speeds, thereby improving timing margins. DDR2 memory chips will come in capacities up to 4 Gigabits, allowing for higher-capacity modules.

The Module is DDR-333 CL2.5 ECC Unbuffered Memory module. The Module density from 256MB to 1GB, it consists 32/64MX8 bit DDR-333 Synchronous DRAMs in TSOP II packages, Memory Module intented for mounting into 184-pin edge connector sockets.